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- Gelid Solutions GC-4-1g Thermal Compound for ...
Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
LAK 364060
Price Details
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The state-of-the-art cooling solution for gamers & tech-enthusiasts.
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What Stands Out
Product Details
- Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
- Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
- Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
| Product Dimensions (L x W x H) | 3.54 x 3.94 x 0.39 inches (9 x 10 x 1 cm) |
| Item Weight | 0.317 ounces (8.99 grams) |
| Manufacturer | Gelid Solutions |
| Item model number | TC-GC-04-A |
| Is Discontinued By Manufacturer | No |
| Date First Available | March 14, 2023 |
Who Should Buy?
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PC Builders
Ideal for enthusiasts assembling custom PCs, ensuring optimal thermal management for CPUs and GPUs during heavy use.
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Gaming Enthusiasts
Perfect for gamers who require superior cooling performance during long gaming sessions to maintain system stability.
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Overclockers
Excellent choice for users planning to overclock their CPUs, as it provides maximum thermal conductivity for efficient heat dissipation.
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Casual Users
May be excessive for everyday computer users who do not push their systems to high thermal limits.
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Budget Builders
Could be too expensive for entry-level builds where lower-cost thermal solutions may suffice without significant performance loss.
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Non-Tech Savvy
Not ideal for users unfamiliar with thermal compounds or installation processes, potentially resulting in improper application.
Product Description
Customer Questions & Answers
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Question:
What is the Gelid Solutions GC-4 thermal compound used for?
Answer: The Gelid Solutions GC-4 thermal compound is primarily designed to enhance thermal conductivity between heat-generating components and heat sinks. By filling microscopic gaps and imperfections, it allows for more efficient heat transfer, which is crucial for maintaining optimal operating temperatures in CPUs, GPUs, and other electronics. This compound is suitable for both DIY builders and professionals looking to ensure their systems run smoothly, especially during intense gaming or high-performance workloads. -
Question:
What makes GC-4 thermal compound stand out in the market?
Answer: GC-4 stands out due to its maximum thermal conductivity capabilities, ensuring effective heat dissipation. Its non-corrosive formulation means it won’t damage sensitive components, setting it apart from other compounds that may contain conductive materials that could pose risks. Users often appreciate its application ease, allowing for a mess-free experience. Many gamers and PC builders choose GC-4 to keep their systems running cooler and quieter while maximizing performance under load. -
Question:
How to apply Gelid Solutions GC-4 thermal compound?
Answer: To apply the GC-4 thermal compound, first, clean the surfaces of both the CPU/GPU and the heat sink with isopropyl alcohol to remove any old thermal paste or contaminants. Next, apply a small pea-sized dot of GC-4 directly onto the center of the CPU or GPU. Once the heat sink is pressed down, the compound will spread evenly, filling any gaps for optimal thermal transfer. Proper application is crucial for achieving the best thermal performance, especially in high-demand scenarios. -
Question:
Is Gelid Solutions GC-4 thermal compound safe for all computer components?
Answer: Yes, the Gelid Solutions GC-4 thermal compound is designed to be safe for all standard computer components. Its non-corrosive nature makes it suitable for use on delicate surfaces, preventing potential damage during application. This feature is vital for users who regularly upgrade or adjust their systems, as it eliminates worries about residual paste affecting other components. Whether you're a casual user or an enthusiast, GC-4 provides peace of mind with its safe composition. -
Question:
What are the thermal conductivity specifications of GC-4?
Answer: The Gelid Solutions GC-4 boasts an impressive thermal conductivity rating, which contributes to its effectiveness. With a conductivity of around 8.5 W/mK, GC-4 competes favorably with many premium thermal pastes available on the market. This high level of conductivity ensures that the heat generated by your processor or GPU is dissipated efficiently, helping maintain low temperatures during intensive tasks like gaming or video rendering, thereby enhancing overall performance. -
Question:
Can GC-4 thermal compound be reused?
Answer: No, once the Gelid Solutions GC-4 thermal compound is applied and the heat sink is secured, it should not be reused after removal. The compound is designed for single-use to maintain optimal thermal conductivity. If you need to take off the heat sink or replace components, it’s recommended to clean off the old compound and apply fresh paste. This ensures continuous and effective heat transfer, particularly in high-performance scenarios requiring consistent cooling. -
Question:
What are the storage recommendations for Gelid Solutions GC-4?
Answer: To ensure the longevity and effectiveness of Gelid Solutions GC-4 thermal compound, store it in a cool, dry place away from direct sunlight and high temperatures. Keeping the compound capped and ensuring it's free from contaminants will maintain its properties. Users often benefit from having a tube on hand as a precaution, as it enables quick application when needed, especially before major system upgrades or if monitoring performances during intense usage. -
Question:
How does GC-4 perform in comparison to liquid metal thermal compounds?
Answer: While liquid metal compounds often offer greater thermal conductivity, Gelid Solutions GC-4 provides a solid balance between performance, safety, and usability. GC-4 is non-conductive, reducing the risk of short circuits, unlike liquid metals which can lead to potential damage if spilled. For most users, GC-4 delivers sufficient cooling performance for CPUs and GPUs, making it an ideal choice for regular system maintenance without the risk associated with liquid metal applications. -
Question:
Is Gelid Solutions GC-4 suitable for laptops?
Answer: Yes, Gelid Solutions GC-4 thermal compound is suitable for use in laptops. Its effective thermal conductivity ensures efficient heat dissipation, which is essential in compact devices prone to overheating. Many users apply GC-4 during laptop maintenance or upgrades to improve cooling efficiency, particularly in high-performance configurations. This makes it an excellent choice for gamers or professionals looking to optimize their laptop's performance and longevity. -
Question:
Where can I buy Gelid Solutions GC-4-1g Thermal Compound in Laos?
Answer: You can buy Gelid Solutions GC-4-1g Thermal Compound at Ubuy in Laos. Ubuy offers a straightforward purchasing process for this high-quality thermal compound, ensuring you can easily access this product to enhance your systems. Their platform provides reliable services, making it convenient for both DIY enthusiasts and professionals to get the thermal solution they need to maintain optimal performance.
Gelid Solutions Silicon Grease TC-GC-04-A Editorial Review
The Gelid Solutions GC-4-3.5g Thermal Compound is receiving positive reviews from customers. Many users have reported that this thermal compound has significantly reduced their CPU and GPU temperatures under heavy load. One customer mentions that compared to another thermal paste they previously used, the GC-4 brought their Ryzen 5 5700G temperatures down from 82C to 75C. Another user experienced a decrease in temperature from 87C to 83C on their RTX 2060, even while overclocked. Customers appreciate that the GC-4 lives up to its advertised claims. It is easy to apply and provides maximum thermal conductivity. One user specifically recommends this thermal compound for AMD builds. They mention that it has helped keep their CPU temperature Consistently low, even during heavy usage. However, there are a few mixed reviews. One customer mentioned experiencing a pump-out effect over time, indicating that the compound may not be suitable for long-term use. Another user had a positive short-term experience but required a more viscous thermal compound for sustained performance. Overall, the Gelid Solutions GC-4-3.5g Thermal Compound is praised for its affordability and great performance. It effectively lowers temperatures and helps maintain cooler room temperatures. It is a recommended choice for those seeking to improve and optimize their CPU and GPU cooling.
Customer Reviews & Ratings
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5 Star
85%
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4 Star
6%
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3 Star
5%
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2 Star
3%
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1 Star
1%
Review this product
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Pros
- Significantly reduces CPU and GPU temperatures under heavy load
- Easy to apply
- Maximum thermal conductivity
- Affordable price
- Helps maintain cooler room temperatures
Cons
- May not be suitable for long-term use due to the pump-out effect
Product Price History
Important information
- Limitations : For products shipped internationally, please note that any manufacturer warranty may not be valid; manufacturer service options may not be available; product manuals, instructions, and safety warnings may not be in destination country languages; the products (and accompanying materials) may not be designed in accordance with destination country standards, specifications, and labeling requirements; and the products may not conform to destination country voltage and other electrical standards (requiring use of an adapter or converter if appropriate). The recipient is responsible for assuring that the product can be lawfully imported to the destination country. When ordering from Ubuy or its affiliates, the recipient is the importer of record and must comply with all laws and regulations of the destination country.
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LAK 364060
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Features & Benefits
- Ultimate heat conductivity
- Non-electrical conductive
- Ultra durable & non-curing
- No bleeding & user friendly
- Enhanced micron-particle synthetic thermal filler and polymer matrix
- Stable performance under a wide range of temperatures






