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Item #:
190533222
Dow Corning 340 Silicone Heat Sink Compound 5oz 142g White Silicone Thermal Coupling Heat Conductive Grease for Electrical Devices PCB Assemblies
Item #:
190533222
LAK 1181292
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Dow Corning 340 Heat Sink Compound increases reliability with heat flow away from circuitry components.
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What Stands Out
High Thermal Conductivity
This silicone grease offers superior heat transfer, effectively reducing overheating in CPUs and electronics, ensuring optimal performance and longevity of sensitive components.
Non-Flowing Formula
Designed to stay in place, the non-flowing consistency prevents unwanted movement, making it ideal for vertical applications and ensuring consistent thermal contact across surfaces in PCB assemblies.
Versatile Application
Suitable for various electronic devices, this compound excels in diverse settings from computers to industrial assemblies, catering to the needs of hobbyists and professionals alike.
Product Details
- Dow Corning DOWSIL 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g Tube. White, non-flowing, highly filled compound, good thermal conductivity. Uses Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks Benefits Thermally conductive compound 1 part Non flowing No need for ovens or curing Increases reliability with heat flow away from circuitry components Dow Corning 340 Thermal Compound is a grease-like silicone material with a high amount of thermally conductive metal oxide fillers. This compound has high thermal conductivity, low oil bleed and good high temperature stability. The compound can maintain consistency up to about 177°C. Therefore, it helps to maintain a reliable heat sink seal, which will improve the heat transfer from the electrical/electronic components to the heat sink or chassis. Dow Corning 340 Thermal Compound is used for bases and mounting bolts of transistors, diodes and thyristor rectifiers. It can also be used for effective thermal connection of many heat sinks that require effective cooling. Typical Use:Compound provides thermal coupling of electrical/electronic devices to heat sinks, can be applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. Brand:Dow Corning Color:White Components:1 part Dielectric Strength:210 V/mil Flash Point:>101.1 °C Specific Gravity: 2.1 Thermal Conductivity:0.67 W/mK Viscosity:542,000 Volume Resistivity:2 x 10^15 ohm-cm
| Machine & tool lubricant type | Lubricating Oil |
| Brand | DOWSIL |
| Container type | Tube |
| Volume capacity | 5 oz |
| Cleanser form | Gels |
| Size | 6.69 × 1.77 × 1.38 in 0.36 lbs |
| Vehicle fitment type | Universal |
| Automotive parts division | Mechanic Tools |
| Material | Silicone |
| Color | White |
| Weight | 0.36 lb (160 grams) |
| Product net content uom | Gram |
| Product net content parent | 142 Gram |
| Flash point | >300 |
| Has written warranty | No |
| Model | 340 |
Product Description
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Customer Questions & Answers
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Question:
What is the primary use of Dow Corning 340 Heat Sink Compound?
Answer: It is primarily used for thermal coupling of electrical devices and PCB assemblies to heat sinks. -
Question:
Does this compound require curing or special application methods?
Answer: No, it is non-curing and does not require ovens for application. -
Question:
What is the maximum temperature stability of this compound?
Answer: It can maintain consistency up to approximately 177°C.
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LAK 1181292
Order now and get it around Saturday, October 10
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
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Features & Benefits
- One-component, grease-like silicone for effective thermal coupling.
- Non-flowing and non-curing, easy application without ovens.
- High thermal conductivity with low oil bleed.
- Maintains consistency up to 177°C, improving heat transfer.
- Designed for transistors, diodes, and various electronic components.
- Reliable seal for better cooling efficiency in electronic devices.
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